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Teradici secures US$18 million in funding

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On February 14, 2007, Teradici Corporation announced that it had secured $18 million in venture capital funding. Alloy Ventures led the round with participation from return investors the Working Opportunity Fund, Skypoint Capital, BDC Venture Capital and Alta Berkeley Venture Partners. Teradici will use this capital to fund its 2007 go-to-market plan while, in parallel, accelerating its second and third generation product strategies. Building upon its highly successful first product development, the company will expand its engineering teams to deliver further optimizations and advancements in graphics compression and high-speed chip design. Teradici will also strengthen its operations, sales and marketing functions as it approaches volume production and broad-based customer adoption. Teradici, headquartered in Burnaby, British Columbia,  is a fabless semiconductor company developing innovative technology for next-generation computer form factors. Teradici was advised in this transaction by a team from Fasken Martineau comprised of Keith Spencer, Frank Schober (tax) and Maryam Zargar (technology).


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